| Equipment size（ L×W×H ） |
2600×1800×1650(mm) |
| Equipment weight |
1800kg |
| PCB positioning mode |
mechanical positioning |
| Work Piece |
| Minimum PCB size (including fixture) |
L120mm W60mm |
| Maximum PCB size (including fixture) |
L508mm W458mm |
| PCB thickness |
0.5~6mm |
| PCB weight |
Max. 5KG |
| PCB up component height |
Max. 100mm |
| PCB down component height |
Max. 50mm |
| PCB technology edge |
4mm |
| PCB Pin spacing |
≥0.8mm |
| Distance between soldering pad and components |
≥1mm |
| PCB transport belt height |
900±20mm |
| PCB transport speed |
0.2~10 m/min |
| PCB transport Angle |
0° |
| PCB transportation direction |
L-R |
| Transport model |
Monorail and section transport |
| Width adjustment range |
60~450 mm |
| Adjustable width precision |
±0.2mm |
| Adjustable wide way |
Each module automatically independent/unified adjust |
| Fluxer Spray |
| Movement form |
PCB board does not move, XY platform moving |
| Flux capacity |
2L |
| Type of flux |
Wash free/water base |
| Flux low level detection |
Low level automatic alarm |
| Number of spray heads |
Single nozzle（Optional double sprinkler head） |
| Spray driven mode |
High frequency solenoid valve |
| Spray type |
Point spray/line spray |
| Nozzle size of spray nozzle |
130um（Can match according to the demand） |
| Spray range |
3-8mm |
| Spray working pressure |
0.05Mpa~0.1MPa |
| Continuous spray rate |
0~20mm/s |
| Moving speed |
0~400mm/s |
| Positioning accuracy |
±0.25mm |
| Effective preheating area |
L500mm×W450mm |
| bottom side（bottom preheating） |
| Preheating temperature |
 room temperature～250℃ |
| Temperature control accuracy |
±15℃ |
| temperature control mode |
Closed loop control + power control |
| Heating mode |
Infrared preheating, infrared radiation |
| Heating power |
12KW (1.5KWX8) |
| top side（top preheating） |
| Preheating temperature |
 room temperature～250℃ |
| Temperature control accuracy |
±15℃ |
| temperature control mode |
Closed loop control + power control |
| Heating mode |
Hot air preheating, hot air backflow |
| Heating power |
6KW |
| bottom side |
| PCB positioning mode |
mechanical positioning |
| Movement form |
PCB board not moving, XYZ platform moving |
| Mechanical pump tin furnace |
single tin furnace（Optional double tin furnace） |
| Double tin furnace spacing |
Min:120mm; Max:225 |
| Double tin furnace motion form |
Synchronous operation |
| Tin furnace capacity |
8KG/tin stove |
| Tin furnace liquid level detection |
Automatic detection of high and low tin level |
| Tin wave driven |
Motor drive（Optional electromagnetic drive） |
| Tin stove temperature |
room temperature～300℃ |
| Temperature control accuracy |
±2℃ |
| Heating power |
1.6 KW/tin stove |
| Tin wave height |
3~5mm |
| Moving and positioning speed |
Max. 400mm/s |
| stroke/speed of tin furnace |
50 mm 100mm/S |
| Standard tin nozzle specifications |
φ3~10mm(内径)（Non- standard customization is acceptable） |
| The tin time |
≤40min/(300℃) |
| Soldering precision |
±0.25mm |
| Welding precision |
The diameter of tin Wire 2mm，max.4kg |
| Peak height detection |
Fixed probe |
| Process visualization |
CCD visual |
| Oxidation rate of solder pot |
In the case of nitrogen 1.5 m3/ h, the oxidation amount is 0.12kg/8hTin stove |
| operating system |
Windows |
| Software language |
Chinese and English can be switched |
| programmatically |
Online programming, offline programming |
| Data import |
Gerber, image import |
| Power supply (three-phase five-wire) |
3P5W,380VAC,50/60Hz 52A,35KW |
| Compressed air pressure |
0.5Mpa |
| Compressed air pressure detection |
Low pressure automatic alarm |
| Compressed air consumption |
≤0.014m3/h |
| N2 pressure |
0.5Mpa～0.8Mpa |
| N2 pressure detection |
ow pressure automatic alarm |
| N2 purity |
≥99.999% |
| N2 consumption |
（1.5m3/h～1.8m3/h）/ tin stove |
| Exhaust air |
360m3/h |
| Exhaust pipe diameter |
φ150mm（2个） |
