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SMT Lead-Free Solder Paste

Product Functions

Low-temperature alloy, Medium and low temperature laser soldering paste, SMT Solder paste, low void solder paste、QFN solder paste Semiconductor high temperature high lead solder paste, mini LED Die Bond solder paste photovoltaic junction box solder pastewashable solder paste Low residue anti solder bead solder paste all types of solder paste and die bound solder paste.

ISO Certified

Top Rated

Cost Effective

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Product Features

Specification:

MidLow Temperature Series Laser welding solder paste

The Laser solder paste is adopted with fast laser and soldering, the shortest soldering time can be 300ms, without weld spatter during the process, solder spot is full without residual.

   Item

Q5

Q4

Alloy ingredients

Sn42Bi58

SnBiAg1

Packing

  1. 30g/Jar,10cc syringes
  2. 100g/Jar,30cc syringes
  1. 30g/Jar,10cc syringes
  2. 100g/Jar,30cc syringes

Application Product(Process)

Point tin process

Point tin process

Character

  • Chemical properties stable, meet the long-term soldering requirement
  • Good solderability, no splash, no solder ball
  • Solder spot is full, bright, strong, excellent electrical properties.
  • Solder flux splash less with little residual, easy to clean.

Semiconductor high temperature solder paste

This is designed for power semiconductors and high temperature assembly of micromodules and embedded system, packing by Jar and Syringes for multiple choices like automatic soldering, needle transfer and printing process. Formulated in order to achieve very low levels of voiding, and to remove easily the flux residues when reflow cleaning is required

  Item4BG88H1KTS-338-901Q9-CPG
Alloy ingredientsSn5Pb92.5Ag2.5Sn5Pb92.5Ag2.5Sn5Pb92.5Ag2.5
Packing500g/Jar500g/Jar
  1. 100g/EA,30ccsyringes
  2. 200g/EA,55ccsyringes
Application Product(Process)Printing/Needle transfer processPrinting/Needle transfer processSemiconductor point tin process
Character
  • Chemical properties stable,meet the long-term soldering requirement、needle transfer and printing performance
  • Good solderability, no splash, no solder ball, high yield, solder point porosity lower to 10%.
  • Solder spot is full, bright, strong, excellent electrical properties.
  • Solder flux splash less with little residual.

miniLED Die Bond Solder paste

  Item

6ULK

Q3-CPG  T6

Alloy ingredients

Sn96.5Ag3Cu0.5

Sn96.5Ag3Cu0.5

Packing

500g/Jar

  1. 10/30g/EA,10cc/syringes
  2. 100g/EA,30cc/syringes

Application Product(Process)

Mini LED Printing process

Mini LED Needle transfer process

Character

  • Formulated with T6(5-15μm) ultrafine powder, more precise control of tined performance
  • Small viscosity change during printing and needle transfer . Stable and smooth for tin speed. Low void level to improve heat dissipation
  • Highly reactive, very good wetting on all the coating lead frames.
  • Solder flux splash less with little residual.

Photovoltaic solder paste

  Item

F6

Q36-3

Alloy ingredients

Sn63Pb37

Sn99Ag0.3Cu0.7

Packing

500g/Jar

  1. 100g/EA,30cc/syringes
  2. 200g/EA,55cc/syringes
  3.  500g/Jar

Application Product(Process)

PV Function box

Character

  • Very good wettability, without corrosion for the board.
  • Small viscosity change during printing and needle transfer . Stable and smooth for tin speed.
  • Solder spot is full, bright, good reliability, low defect.
  • Solder flux splash less with little residual, no sticky. Colorless transparent.

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