Specification:
Mid、Low Temperature Series Laser welding solder paste
The Laser solder paste is adopted with fast laser and soldering, the shortest soldering time can be 300ms, without weld spatter during the process, solder spot is full without residual.
Item | Q5 | Q4 |
Alloy ingredients | Sn42Bi58 | SnBiAg1 |
Packing |
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Application Product(Process) | Point tin process | Point tin process |
Character |
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Semiconductor high temperature solder paste
This is designed for power semiconductors and high temperature assembly of micromodules and embedded system, packing by Jar and Syringes for multiple choices like automatic soldering, needle transfer and printing process. Formulated in order to achieve very low levels of voiding, and to remove easily the flux residues when reflow cleaning is required
Item | 4BG88H1 | KTS-338-901 | Q9-CPG |
Alloy ingredients | Sn5Pb92.5Ag2.5 | Sn5Pb92.5Ag2.5 | Sn5Pb92.5Ag2.5 |
Packing | 500g/Jar | 500g/Jar |
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Application Product(Process) | Printing/Needle transfer process | Printing/Needle transfer process | Semiconductor point tin process |
Character |
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miniLED Die Bond Solder paste
Item | 6ULK | Q3-CPG T6 |
Alloy ingredients | Sn96.5Ag3Cu0.5 | Sn96.5Ag3Cu0.5 |
Packing | 500g/Jar |
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Application Product(Process) | Mini LED Printing process | Mini LED Needle transfer process |
Character |
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Photovoltaic solder paste
Item | F6 | Q36-3 |
Alloy ingredients | Sn63Pb37 | Sn99Ag0.3Cu0.7 |
Packing | 500g/Jar |
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Application Product(Process) | PV Function box | |
Character |
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