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Vacuum Reflow Oven (TRV Series)

Product Functions

Vacuum reflow process is a kind of technology which makes the reflow soldering process in vacuum environment. In the vacuum environment, due to the pressure difference between inside and outside of the solder joint and maintaining a certain period of time, the bubbles in the solder joint are easy to overflow, the void rate of the solder joint is greatly reduced, and the combination of vacuum and reflux welding is realized.

ISO Certified

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Cost Effective

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Product Features

  • Multi-temperature areas, independent temperature control, to meet the requirements of different temperature curves, the size of vacuum chamber can be customized;
  • Effectively solve the bubbles after soldering; the void rate can be reduced to less than 2%;
  • Efficient vacuum pump group can achieve rapid step-down;
  • Equipped with three-section transportation systems: heating area, vacuum unit and cooling part, separately adjustable.
  • Three modes of operation: vacuum production mode, general production mode, temperature measurement mode, to meet different needs.
  • Efficient soldering flux recovery system to prevent rosin residue;
  • High-quality electrical components and intelligent control system;
  • Built-in UPS and automatic delay shutdown system, to ensure that the PCB will be automatically sent from the equipment when the power failure.
Specification:
Model TRV-800-N TRV-1000-N TRV-1200-N
Dimension 5520*1430*1530mm 6300*1430*1530mm 7050*1430*1530mm
Electronic required 3phase,380V 50HZ/60HZ
Heating zones Top8(1 IR)+Bottom7 Top10(1 IR)+Bottom9 Top12(1 IR)+Bottom11
 Cooling zones Top3+Bottom3
Vacuum pressure range ≥5mbr
Temp. range of hot air Room temperature~350℃
Temp. range of vacuum chamber Room temperature~280℃(optional:320℃)
Conveyor 300~1700mm/min
PCB Height PCB Top30mm/Bottom20mm
L*W PCB size L:min150mm,max300mm      W:min100mm,max400mm
Gas pressure N2/0.4-0.6Mpa
Model TRV-800D-N TRV-1000D-N TRV-1200D-N
 Dimension 5520*1660*1530mm 6300*1660*1530mm 7050*1660*1530mm
Electronic required 3phase,380V 50HZ/60HZ
Heating zones Top8(1 IR)+Bottom7 Top10(1 IR)+Bottom9 Top12(1 IR)+Bottom11
 Cooling zones Top3+Bottom3
Vacuum pressure range ≥5mbr
Temp. range of hot air Room temperature~350℃
Temp. range of vacuum chamber Room temperature~280℃(optional:320℃)
Conveyor 300~1700mm/min
PCB Height PCB Top30mm/Bottom20mm
L*W PCB size L:min150mm,max300mm W:Dual-Channel min100mm, parallel pass max250mm*2
Gas pressure N2/0.4-0.6Mpa
Contracts between “without vacuum” and “with vacuum”

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