Equipment size( L×W×H ) |
2600×1800×1650(mm) |
Equipment weight |
1800kg |
PCB positioning mode |
mechanical positioning |
Work Piece |
Minimum PCB size (including fixture) |
L120mm W60mm |
Maximum PCB size (including fixture) |
L508mm W458mm |
PCB thickness |
0.5~6mm |
PCB weight |
Max. 5KG |
PCB up component height |
Max. 100mm |
PCB down component height |
Max. 50mm |
PCB technology edge |
4mm |
PCB Pin spacing |
≥0.8mm |
Distance between soldering pad and components |
≥1mm |
PCB transport belt height |
900±20mm |
PCB transport speed |
0.2~10 m/min |
PCB transport Angle |
0° |
PCB transportation direction |
L-R |
Transport model |
Monorail and section transport |
Width adjustment range |
60~450 mm |
Adjustable width precision |
±0.2mm |
Adjustable wide way |
Each module automatically independent/unified adjust |
Fluxer Spray |
Movement form |
PCB board does not move, XY platform moving |
Flux capacity |
2L |
Type of flux |
Wash free/water base |
Flux low level detection |
Low level automatic alarm |
Number of spray heads |
Single nozzle(Optional double sprinkler head) |
Spray driven mode |
High frequency solenoid valve |
Spray type |
Point spray/line spray |
Nozzle size of spray nozzle |
130um(Can match according to the demand) |
Spray range |
3-8mm |
Spray working pressure |
0.05Mpa~0.1MPa |
Continuous spray rate |
0~20mm/s |
Moving speed |
0~400mm/s |
Positioning accuracy |
±0.25mm |
Effective preheating area |
L500mm×W450mm |
bottom side(bottom preheating) |
Preheating temperature |
 room temperature~250℃ |
Temperature control accuracy |
±15℃ |
temperature control mode |
Closed loop control + power control |
Heating mode |
Infrared preheating, infrared radiation |
Heating power |
12KW (1.5KWX8) |
top side(top preheating) |
Preheating temperature |
 room temperature~250℃ |
Temperature control accuracy |
±15℃ |
temperature control mode |
Closed loop control + power control |
Heating mode |
Hot air preheating, hot air backflow |
Heating power |
6KW |
bottom side |
PCB positioning mode |
mechanical positioning |
Movement form |
PCB board not moving, XYZ platform moving |
Mechanical pump tin furnace |
single tin furnace(Optional double tin furnace) |
Double tin furnace spacing |
Min:120mm; Max:225 |
Double tin furnace motion form |
Synchronous operation |
Tin furnace capacity |
8KG/tin stove |
Tin furnace liquid level detection |
Automatic detection of high and low tin level |
Tin wave driven |
Motor drive(Optional electromagnetic drive) |
Tin stove temperature |
room temperature~300℃ |
Temperature control accuracy |
±2℃ |
Heating power |
1.6 KW/tin stove |
Tin wave height |
3~5mm |
Moving and positioning speed |
Max. 400mm/s |
stroke/speed of tin furnace |
50 mm 100mm/S |
Standard tin nozzle specifications |
φ3~10mm(内径)(Non- standard customization is acceptable) |
The tin time |
≤40min/(300℃) |
Soldering precision |
±0.25mm |
Welding precision |
The diameter of tin Wire 2mm,max.4kg |
Peak height detection |
Fixed probe |
Process visualization |
CCD visual |
Oxidation rate of solder pot |
In the case of nitrogen 1.5 m3/ h, the oxidation amount is 0.12kg/8hTin stove |
operating system |
Windows |
Software language |
Chinese and English can be switched |
programmatically |
Online programming, offline programming |
Data import |
Gerber, image import |
Power supply (three-phase five-wire) |
3P5W,380VAC,50/60Hz 52A,35KW |
Compressed air pressure |
0.5Mpa |
Compressed air pressure detection |
Low pressure automatic alarm |
Compressed air consumption |
≤0.014m3/h |
N2 pressure |
0.5Mpa~0.8Mpa |
N2 pressure detection |
ow pressure automatic alarm |
N2 purity |
≥99.999% |
N2 consumption |
(1.5m3/h~1.8m3/h)/ tin stove |
Exhaust air |
360m3/h |
Exhaust pipe diameter |
φ150mm(2个) |