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IC Curing Oven

Product Functions

ISO Certified

Top Rated

Cost Effective

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Product Features

  • It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. The smart IC card tape is mainly used for the SIM card contact module, the social security card contact module, the financial card contacts module and the like.
  • Adopting the display control touch screen plus Siemens PLC precise temperature control, the three sections have a total temperature control of 24 zones, the transmission motor adopts stepper motor, the transportation is stable, and the software comes with temperature curve test.

Specification:

ModelHJE-R1600-A
Dimensions(L×W×H)3600×974×1205(mm)
WeightApprox.600kg
Transport Height900±20mm
Transport speed0-2000mm/min
Transport directionL→R(R→L)
Transmission motor power  57#stepper motor DC4.2A
PCB Width36mm
Heating pipe qty.:Upper layer 24 ,lower layer 24
Temp. zone qty.3 sections of 24 temperature zones
Cover opening methodPneumatic lifting
Heating plate typeCeramic infrared heating plate
Temp. adjustment rangeRoom Temp.—220℃
Heating Arising time8-10MIN
PCB board sizeTape type IC chip tape
Control MethodTouch Screen
Power supply3-phase 4-wire system AC380V 50/60Hz
Total power12KW

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