IC Curing Oven
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. […]
It is used for baking after die bonder die bonding of ASM ESEC, etc. in the semiconductor chip manufacturing process. […]
Using precision guide rail and the Panasonic speed regulating motor to drive the scraper, ensure the printing stability and precision;
Using precision guide rail and the Panasonic speed regulating motor to drive the scraper, ensure the printing stability and precision;
Drip cleaning system Total new squeegee blade structure design Guide Rail positioning System CCD digital camera system High precision adjustable
Specification: Model No. GSK Machine Performance Repeat Position Accuracy ±12.5um@6o CPK≥2.0 Print Accuracy ±22um@6o CPK≥2.0 NCP-CT (Cleaning and printng not
Specification: Model No. GSE Machine Performance Repeat Position Accuracy ±0.01mm Print Accuracy ±0.025mm NCP-CT (Cleaning and printing
Specification: Model No. GLE Machine Performance Repeat Position Accuracy ±12.5um@6o,CPK≥2.0 Print Accuracy ±20um@6o,CPK≥2.0 NCP-CT (Cleaning and printing not included) <7.5
Specification: Model No. G5 Machine Performance Repeat Position Accuracy ±0.01mm Print Accuracy ±0.025mm NCP-CT (Cleaning and printing not included) 7.5s
SCALABLE Match line capacity to production needs Integrate software modules when business dictates Single-line facilities to multi-nationals INTEGRATED For any
One platform solution for any kind of production Commonality with existing equipment Linear motor drive increase reliability and reduces maintenance